led high power - liteon · 2015. 1. 7. · qs Φv 942 1016 lm if=700ma su 1016 1098 uw 1098 1190 wy...

1

LED HIGH POWER C08-M Product Series

BNC-OD-C131/A4 Created Date : 05/26/2007 Revison : 1.01, 05/26/2008

LED HIGH POWER C08 Product Series Data Sheet Created Date: 03 / 08 / 2013 Revision: 1.3, 03 / 15 / 2013

LED HIGH POWER C08-M Product Series Data Sheet Created Date: 03 / 01 / 2014 Revision: 0.3, 06 / 17 / 2014

02


BNC-OD-C131/A4 Created Date: 03/01/2014 Revision: 0.3, 06/17/2014

1. Description

The LiteON C08-M Product series is a revolutionary, energy efficient and ultra-compact new light source, combining the lifetime and reliability advantages of Light Emitting Diodes with the brightness of conventional lighting. It gives you total design freedom and unmatched brightness, creating a new opportunities for solid state lighting to displace conventional lighting technologies.

1.1 Features � Compact high flux density light source � Uniform high quality illumination � Streamlined thermal path � MacAdam compliant binning structure

More energy efficient than incandescent, halogen and fluorescent lamps

� Instant light with unlimited dimming � RoHS compliant and Pb free � DC 12V application

� Enhanced optical control � Clean white light without pixilation � Uniform consistent white light � Significantly reduced thermal resistance and increased

operating temperatures � Lower operating costs � Reduced maintenance costs � ESD rating is 8KV in HBM

1.2 Available Part Numbers

Nominal CCT Minimum CRI Forward Voltage Part Number

3000K 70 12V LTPL-C08EXS30-M

4000K 70 12V LTPL-C08EXS40-M

5000K 70 12V LTPL-C08EXS50-M

5700K 70 12V LTPL-C08EXS57-M

2700K 80 12V LTPL-C08EZS27-M

3000K 80 12V LTPL-C08EZS30-M

4000K 80 12V LTPL-C08EZS40-M

5000K 80 12V LTPL-C08EZS50-M

03



2. Outline Dimensions

2.1 Form Factor

� LTPL-C08EXXXX-M

Notes

1. All dimensions are in millimeters and dimension tolerances are ± 0.2mm except lens height and ceramic length /

width dimension tolerance are ± 0.1mm.

2. Thermal pad of the device is electrically neutral from the anode and cathode pads.

04



3. Rating and Characteristics

3.1 Absolute Maximum Ratings at Ta=25°C.

Parameter Symbol Rating Unit

Power Dissipation Po 10 W

DC Forward Current IF 800 mA

ESD Sensitivity VB 8 kV

Junction Temperature Tj 125 °C

Thermal Resistance, Junction-Case Rth, J-C 3.3 °C / W

Operating Temperature Range Topr -40~+85 °C

Storage Temperature Range Tstg -55~+100 °C

Notes 1. The pulse mode condition is 1 KHz with 0.1msec pulse width.. 2. Forbid to operating at reverse voltage condition 3. ESD spec is reference to AEC-Q101-001 HBM. 4. The unit of Rth is °C/W electrical. 5. Thermal resistance measurement tolerance is ± 10%

05



3.2 Electro-Optical Characteristics

� LTPL-C08EXXXX-M

Nominal CCT

Minimum CRI

Current (mA)

Typ. VF (V) @25°°°°C

Typ. Flux(lm) @25°°°°C

Typ. VF (V) @85°°°°C

Typ. Flux(lm) @85°°°°C

Eff.(lm/W) @25°°°°C

Eff.(lm/W) @85°°°°C

3000K 70 700 12.5 1055 12.1 939 121 111

4000K 70 700 12.5 1074 12.1 956 123 113

5000K 70 700 12.5 1084 12.1 965 124 114

5700K 70 700 12.5 1086 12.1 967 124 114

2700K 80 700 12.5 952 12.1 847 109 100

3000K 80 700 12.5 1005 12.1 894 115 105

4000K 80 700 12.5 1023 12.1 910 117 107

5000K 80 700 12.5 1032 12.1 919 118 108

Notes 1. All of the VF value are typical and the real bin range please refer page 10 ”VF Binning Parameter”. 2. All of the Flux value are typical and the real Bin range please refer page 9~10 ”Flux Binning Parameter”. 3. Tolerance of Flux is ±7%, Tolerance of VF is ±3%, tolerance of CCx/CCy is ±0.01, tolerance of CRI is ±3. 4. LEDs are lighted up and measured with externally parallel connecting leads of LED. 5. Typical viewing angle is 130deg.

06



4. Typical Electrical/Optical Characteristics Curve

� Efficiency Comparison Table

4.1 Relative Flux vs. Current of LTPL-C08EXXXX-M at 25°C

0%

20%

40%

60%

80%

100%

120%

0 200 400 600 800

Re

lati

ve

Lu

min

ou

s F

lux (

%)

Current (mA)

Fig 1. Typical relative luminous flux vs. forward current of LTPL-C08EXXXX-M

Current VF Lumen (lm)

CRI 70 CRI 80

(mA) (V) 3000 4000 5000 5700 2700K 3000 4000 5000

100 10.8 176 179 180 181 158 167 170 172

200 11.2 343 349 353 353 309 327 333 336

300 11.5 501 510 514 515 451 477 485 490

350 11.6 576 586 592 593 519 548 558 564

400 11.7 650 662 668 669 586 619 630 636

450 11.9 723 736 743 744 652 688 701 707

500 12.0 793 807 815 816 715 755 769 776

600 12.2 930 947 956 957 839 886 902 910

700 12.5 1055 1074 1084 1086 952 1005 1023 1032

800 12.7 1185 1206 1218 1220 1069 1129 1149 1160

07



4.2 Relative Spectral Distribution vs. Wavelength C haracteristics at 25°C & 85°C

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

350 400 450 500 550 600 650 700 750 800

25°C

85°C

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

350 400 450 500 550 600 650 700 750 800

25°C

85°C

Fig 2. Relative Spectral Distribution at Tj = 25°C & 85°C

Warm White

CRI 80

Cool White,

CRI 80

25°C

85°C

25°C

85°C

Warm White

CRI 70

Cool White,

CRI 70

08



4.3 Typical Spatial Radiation Pattern

Fig 3. Radiation Characteristics

09



4.4 Forward Current vs. Forward Voltage at 25°C

0

100

200

300

400

500

600

700

800

900

10.0 10.5 11.0 11.5 12.0 12.5 13.0

Cu

rre

nt

(mA

)

Voltage (V)

Fig 4. Forward Current vs. Forward Voltage of LTPL-C08EXXXX-M

4.5 Maximum Forward Current vs. Ambient Temperature

0

100

200

300

400

500

600

700

800

900

0 20 40 60 80 100 120 140

Fo

rwa

rd C

urr

en

t (m

A)

Ambient Temperature (°C)

Fig 5. Forward Current Degrading Curve of LTPL-C08EXXXX-M

010



5. VF Bin Definition

5.1 Forward Voltage Binning Parameter at 25°C

� LTPL-C08EXXXX-M

Parameter Bin Symbol Min Max Unit Condition

Forward Voltage DC1 VF 11.5 12.0 V IF = 700mA




6. Flux Bin Definition

6.1 Luminous Flux Binning Parameter at 25°C

� LTPL-C08EXXXX-M

CRI 70 Series

3000K

Parameter Bin Symbol Min Max Unit condition

Luminous Flux

SU

ΦV

1016 1098

lm If=700mA UW 1098 1190

WY 1190 1281

4000K


Luminous Flux

TV

ΦV

1052 1144

lm If=700mA VX 1144 1235

XZ 1235 1336

5000K


Luminous Flux

TV

ΦV

1052 1144

lm If=700mA VX 1144 1235

XZ 1235 1336

011



5700K


Luminous Flux

TV

ΦV

1052 1144

lm If=700mA VX 1144 1235

XZ 1235 1336

CRI 80 Series

2700K


Luminous Flux

OQ

ΦV

878 942

lm If=700mA QS 942 1016

SU 1016 1098

UW 1098 1190

3000K


Luminous Flux

PR

ΦV

906 979

lm If=700mA RT 979 1052

TV 1052 1144

VX 1144 1235

4000K


Luminous Flux

QS

ΦV

942 1016

lm If=700mA SU 1016 1098

UW 1098 1190

WY 1190 1281

5000K


Luminous Flux

QS

ΦV

942 1016

lm If=700mA SU 1016 1098

UW 1098 1190

WY 1190 1281

012



7. Color Bin Definition

7.1 Chromaticity Coordinate Groups at 25°C

Notes 1. The Chromaticity Coordinate Groups follow ANSI 7-Step MacAdam Quadrangle 2. The (CIEx, CIEy) center follow ANSI Quadrangle

013



7.2 Chromaticity Coordinate Category Code Table at 25°C

� 2700K Series

2700K

0.38

0.39

0.40

0.41

0.42

0.43

0.44

0.43 0.44 0.45 0.46 0.47 0.48 0.49

CIE

-Y

CIE-X

CIE-X CIE-Y

Center point 0.4578 0.4101

ZC (CRI 80)

XC (CRI 70)

0.4813 0.4319

0.4562 0.4260

0.4373 0.3893

0.4593 0.3944

0.4813 0.4319

014



� 3000K Series

3000K

0.37

0.38

0.39

0.40

0.41

0.42

0.43

0.41 0.42 0.43 0.44 0.45 0.46 0.47

CIE

-Y

CIE-X

CIE-X CIE-Y


ZD (CRI 80)

XD (CRI 70)

0.4562 0.4260

0.4299 0.4165

0.4147 0.3814

0.4373 0.3893

0.4562 0.4260

015



� 4000K Series

4000K

0.35

0.36

0.37

0.38

0.39

0.40

0.41

0.35 0.36 0.37 0.38 0.39 0.40 0.41

CIE

-Y

CIE-X

CIE-X CIE-Y


ZF (CRI 80)

XF (CRI 70)

0.4006 0.4044

0.3736 0.3874

0.3670 0.3578

0.3898 0.3716

0.4006 0.4044

016



� 5000K Series

5000K

0.32

0.33

0.34

0.35

0.36

0.37

0.38

0.32 0.33 0.34 0.35 0.36 0.37 0.38

CIE

-Y

CIE-X

CIE-X CIE-Y


ZH (CRI 80)

XH (CRI 70)

0.3551 0.3760

0.3376 0.3616

0.3366 0.3369

0.3515 0.3487

0.3551 0.3760

017



� 5700K Series

CIE-X CIE-Y


ZI (CRI 80)

XI (CRI 70)

0.3376 0.3616

0.3207 0.3462

0.3222 0.3243

0.3366 0.3369

0.3376 0.3616

018



8. Reflow Soldering Characteristics

Profile Feature Lead Free Assembly

Average Ramp-Up Rate (TSmax to TP) 3°C / second max

Preheat Temperature Min (TSmin) 150°C

Preheat Temperature Max (TSmax) 200°C

Preheat Time (tSmin to tSmax) 60 – 180 seconds

Time Maintained Above Temperature (TL) 217°C

Time Maintained Above Time (tL) u – 150 seconds

Peak / Classification Temperature (TP) 255°C

Time Within 5°C of Actual Peak Temperature (tP) 5 seconds

Ramp – Down Rate 6°C / second max

Time 25°C to Peak Temperature 8 minutes max

019



Notes:

1. The LEDs can be soldered using the reflow soldering or hand soldering method. The recommended hand soldering

condition is 350°C max. and 2secs max. for one time only, and the recommended reflow soldering condition is

260°C max. and 5secs max. for three times max.

2. All temperatures refer to topside of the package, measured on the package body surface.

3. The soldering condition referring to J-STD-020B. The storage ambient for the LEDs should not exceed 30°C

temperature or 70% relative humidity. It is recommended that LEDs out of their original packaging are soldered

within one week. For extended storage out of their original packaging, it is recommended that the LEDs were

stored in a sealed container with appropriate desiccant, or desiccators with nitrogen ambient. If the LEDs were

unpacked more than 168hrs, baking the LEDs at 60°C for 24hrs before soldering process.

4. The soldering profile could be further referred to different soldering grease material characteristic. The grease

vendor will provide this information.

5. A rapid-rate process is not recommended for the LEDs cooling down from the peak temperature.

6. Although the recommended reflow conditions are specified above, the reflow or hand soldering condition at

the lowest possible temperature is desirable for the LEDs.

7. LiteOn cannot make a guarantee on the LEDs which have been already assembled using the dip soldering

method.

020



9. Reliability Test Plan

� LTPL-C08EXXXX-M

No Test item Condition Duration Number

of Failed

1 High Temperature Operating Life

(HTOL)

Tc=95°C, IF=700mA DC

(0, 250, 500, 750, 1000hrs) 1K hrs 0/20

2 High Temperature Operating Life

(HTOL)


(0, 250, 500, 750, 1000hrs) 1K hrs 0/20

3 Room Temperature Operating Life

(RTOL)


(0, 250, 500, 750, 1000hrs) 1K hrs 0/20

4 Wet High Temperature Operating

(WHTOL)

85°C/85%RH,

IF=350mA DC 30 min ON/OFF 1K hrs 0/20

5 Power Temperature Cycle (PTMCL)

-40°C to 105°C

15minutes dwell/15minutes transfer

5 minutes ON/5 minutes OFF IF=350mA DC

1K cycles 0/20

6 Non-Operating Thermal Shock (TMSK)

-40°C to 125°C

30minutes dwell,

021



10. Recommend Soldering Pad Layout

Notes:

1. Suggest stencil thickness is maximum 0.10mm

022



11. Package Dimensions of Tape and Reel

Reel Packaging

Note:

1. All dimensions are in millimeters.

2. Empty component pockets sealed with top cover tape.

023



12. Cautions

12.1 An LED is a current-operated device. In order to ensure intensity uniformity on multiple LEDs connected in

parallel in an application, it is recommended that a current limiting resistor be incorporated in the drive circuit, in

series with each LED as shown in Circuit below.

LED

LED

Circuit model A Circuit model B

(A) Recommended circuit.

(B) The brightness of each LED might appear different due to the differences in the I-V characteristics of those

LEDs.

12.2 Do not put any pressure on the light emitting surface either by finger or any hand tool and do not stack the

COB products. Stress or pressure may cause damage to the wires of the LED array.

12.3 This product is not designed for the use under any of the following conditions, please confirm the performance

and reliability are well enough if you use it under any of the following conditions

・Do not use sulfur-containing materials in commercial products including the materials such as seals and

adhesives that may contain sulfur.

・Do not put this product in a place with a lot of moisture (over 85% relative humidity), dew condensation, briny air,

and corrosive gas (Cl, H2S, NH3, SO2, NOX, etc.), exposure to a corrosive environment may affect silver plating.

ESD (Electrostatic Discharge)

Static Electricity or power surge will damage the LED. Suggestions to prevent ESD damage:

Use of a conductive wrist band or anti-electrostatic glove when handling these LEDs.

All devices, equipment, and machinery must be properly grounded.

Work tables, storage racks, etc. should be properly grounded.

Use ion blower to neutralize the static charge which might have built up on surface of the LED’s plastic lens

as a result of friction between LEDs during storage and handling.

ESD-damaged LEDs will exhibit abnormal characteristics such as high reverse leakage current, low forward voltage,

or “no light up” at low currents.

To verify for ESD damage, check for “light up” and VF of the suspect LEDs at low currents.

024



� Lens Handling Remark

The LED should only be picked up by making contact with the sides of the LED body. It should not put any pressure

on the lens either by finger or any hand tool. Do not puncture or push the lens. Below figure illustrate correct and

incorrect handling.

� Storage

The storage ambient for the LEDs should not exceed 30°C temperature or 85% relative humidity.

led high power - liteon · 2015. 1. 7. · qs Φv 942 1016 lm if=700ma su 1016 1098 uw 1098 1190 wy...

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